Semiconductor memory device

ABSTRACT

A semiconductor includes a memory cell, a bit line, a word line, a sense amplifier, and a control circuit. The memory cell stores n levels (where n is a natural number of two or greater). The control circuit controls potentials of the word line and the bit line. In a read of k−1 levels (k≦n) stored in the memory cell, the control circuit, upon applying a given voltage to the word line, determines read data based on first data corresponding to the voltage of the bit line read at a first timing by the sense amplifier and second data corresponding to the voltage of the bit line read, by the sense amplifier, at a second timing different from the first timing.

CROSS-REFERENCE TO RELATED APPLICATIONS

This application is a Continuation application of U.S. Ser. No.14/023,187, filed Sep. 10, 2013, which is based upon and claims thebenefit of priority from Japanese Patent Application No. 2013-029342,filed Feb. 18, 2013, the entire contents of both of which areincorporated herein by reference.

FIELD

Embodiments described herein relate generally to a semiconductor memorydevice that can store two-level data and multi-level data, for example,a NAND flash memory.

BACKGROUND

NAND flash memories tend to have their threshold voltage distributionsbroadened and their data retention properties degraded as memoryelements are miniaturized. Thus, error checking and correction (ECC)such as a low-density parity check (LDPC) may be used which has apowerful correcting capability. However, ECC such as LDPC requiresinformation referred to as soft values and which is different fromvalues read at a normal read level. Thus, a read operation (soft bitread) is performed at a level different from the normal read level, andthe results are used as soft values used for ECC such as LDPC. However,this disadvantageously extends read time.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a diagram showing a semiconductor memory device applied to thepresent embodiment;

FIG. 2 is a circuit diagram showing an example of a memory cell arrayand a bit line control circuit shown in FIG. 1;

FIG. 3 is a circuit diagram showing another example of the memory cellarray and the bit line control circuit shown in FIG. 1;

FIG. 4A and FIG. 4B are cross-sectional views showing an example of amemory cell and a select transistor;

FIG. 5 is a cross-sectional view showing an example of a NAND flashmemory;

FIG. 6 is a diagram showing an example of voltages supplied to regionsshown in FIG. 5;

FIG. 7 is a circuit diagram showing an example of a part of a datastorage circuit shown in FIG. 3;

FIG. 8 is a circuit diagram showing an example of another part of thedata storage circuit shown in FIG. 3;

FIG. 9A and FIG. 9B are diagrams showing an example of a thresholdvoltage, a verify level, and a read level for two-bit, four-level data;

FIG. 10 is a waveform diagram showing examples of signals at sectionsduring a read;

FIG. 11 is a diagram showing relationships between a normal readoperation and read data;

FIG. 12 is a diagram showing relationships between read data and theread level during a common soft bit read;

FIG. 13 is a diagram showing relationships between a current flowingthrough a memory cell and the threshold voltage of the memory cell;

FIG. 14 is a waveform diagram showing examples of signals from sectionsduring a read operation according to a first embodiment;

FIG. 15 is a diagram showing an example of data obtained by a soft bitread with different sense timings;

FIG. 16 is a diagram showing an example of a manner of determining anoptimum read level;

FIG. 17 is a diagram showing an example of a manner of determining theoptimum read level according to a second embodiment;

FIG. 18 is a diagram showing relationships between first page read dataand second page read data and soft bit read data according to a thirdembodiment;

FIG. 19 is a timing chart showing a modification of the secondembodiment;

FIG. 20 is a diagram showing a modification of the second embodiment;and

FIG. 21 is a diagram showing another modification of the secondembodiment.

BRIEF SUMMARY OF THE INVENTION

In general, according to one embodiment, a semiconductor includes amemory cell, a bit line, a word line, a sense amplifier, and a controlcircuit. The memory cell stores n levels (where n is a natural number oftwo or greater). The bit line is connected to the memory cell. The wordline is connected to the memory cell. The sense amplifier is connectedto the bit line to detect a voltage of the bit line. The control circuitcontrols potentials of the word line and the bit line. In a read of k−1levels (k≦n) stored in the memory cell, the control circuit, uponapplying a given voltage to the word line, determines read data based onfirst data corresponding to the voltage of the bit line read at a firsttiming by the sense amplifier and second data corresponding to thevoltage of the bit line read, by the sense amplifier, at a second timingdifferent from the first timing.

According to the present embodiment, in a soft bit read using not onlynormal read levels but also different levels, data is read by a readoperation with a sense timing different from a sense timing for a normalread, thus reducing the time required for the soft bit read.

Furthermore, because of the level of data retention in memory cells, ascheme has recently been proposed in which an optimum read level isdetermined for the data read. However, this read scheme must perform aplurality of read operations in order to set the optimum read level,requiring much time. Thus, the present embodiment performs a readoperation with a sense timing different from the sense timing for thenormal read changed, reducing the read time.

Additionally, during data output, the present embodiment reduces thenumber of bits in output data for the main part of a threshold voltagedistribution, while increasing the number of bits in output data for askirt of the threshold voltage distribution which contains a smallnumber of data, thus reducing the total amount of output data.

The embodiment will be described below with reference to the drawings.The same components are denoted by the same reference numbers throughoutthe drawings.

DETAILED DESCRIPTION Embodiment

FIG. 1 shows a NAND flash memory serving as a semiconductor memorydevice that stores two levels (one bit) or four levels (two bits) inmemory cells.

A memory cell array 1 includes a plurality of bit lines, a plurality ofword lines, a common source line, and memory cells arranged in a matrixand each of which comprises, for example, an EEPROM cell and allows datato be electrically rewritten. The memory cell array 1 connects to a bitcontrol circuit 2 configured to control bit lines and a word linecontrol circuit 6.

The bit line control circuit 2 reads a memory cell in the memory cellarray 1 via the corresponding bit line, detects the state of a memorycell in the memory cell array 1 via the corresponding bit line, andapplies a write control voltage to a memory cell in the memory cellarray 1 via the corresponding bit line to write data to the memory cell.The bit line control circuit 2 connects to a column decoder 3 and a datainput/out (I/O) buffer 4. The column decoder 3 selects from data storagecircuits in the bit line control circuit 2. Data from the memory cellread into the data storage circuit is externally output from a data I/Oterminal 5 via the data I/O buffer 4. The data I/O terminal 5 isconnected to a host (not shown in the drawings) external to a memorychip. The host comprises, for example, a microcomputer and receives thedata output from the data I/O terminal 5. Moreover, the host (not shown)various commands CMD that control the operation of the NAND flashmemory, addresses ADD, and data DT. The write data input to the data I/Oterminal 5 by the host is fed via the data I/O buffer 4, to the datastorage circuit selected by the column decoder 3. The commands andaddresses are fed to a control signal and control voltage generator 7.

The word line control circuit 6 is connected to the memory cell array 1.The word line control circuit 6 selects from the word lines in thememory cell array 1, and applies a voltage required for a read, write,or erase to the selected word line.

The memory cell array 1, the bit line control circuit 2, the columndecoder 3, the data I/O buffer 4, and the word line control circuit 6are connected to the control signal and control voltage generator 7,which controls the memory cell array 1, the bit line control circuit 2,the column decoder 3, the data I/O buffer 4, and the word line controlcircuit 6. The control signal and control voltage generator 7 isconnected to a control signal input terminal 8 and controlled by controlsignals ALE [Address Latch Enable], CLE [Command Latch Enable], WE[Write Enable], and RE [Read Enable] which are input by the host via thecontrol signal input terminal 8. The control signal and control voltagegenerator 7 generates voltages for the corresponding word line and bitline during a write, and generates a voltage supplied to a well asdescribed below. The control signal and control voltage generator 7includes a booster circuit, for example, a charge pump circuit and cangenerate a program voltage and other high voltages.

The bit line control circuit 2, the column decoder 3, the word linecontrol circuit 6, and the control signal and control voltage generator7 form a write circuit and a read circuit.

FIG. 2 shows an example of a configuration of the memory cell array 1and the bit line control circuit 2 shown in FIG. 1. The memory cellarray 1 comprises a plurality of NAND units arranged therein. Each ofthe NAND units comprises 64 memory cells MC which are, for example,connected together in series and which use, for example, EEPROMs, andselect gates S1 and S2 connected in series with the respective oppositeends of the array of the series-connected memory cells MC. The selectgate S2 is connected to a bit line BL0 e, and the select gate S1 isconnected to a source line SRC. Control gates of memory cells MCarranged in each row are all connected to a corresponding one of wordlines WL0 to WL63. Furthermore, all the select gates S2 are connected toa select line SGD, and all the select gates S1 are connected to a selectline SGS.

The bit line control circuit 2 comprises a plurality of data storagecircuits 10. Each of the data storage circuits 10 connects to a pair ofbit lines (BL0 e, BL0 o), (BL1 e, BL1 o), . . . , (BLie, BLio), or(BLne, BLno).

The memory cell array 1 includes a plurality of blocks as shown bydashed lines. Each of the blocks comprises a plurality of NAND units,and for example, data is erased in units of the blocks. Additionally, anerase operation is performed simultaneously on two bit lines connectedto the data storage circuit 10.

Furthermore, a plurality of memory cells MC arranged on every other bitline and connected to one word line (the memory cells within a rangeenclosed by dashed lines) forms a page. Data is written to and read fromeach page. That is, half of the plurality of memory cells arranged in arow direction is connected to the corresponding bit lines. Thus, a writeoperation or a read operation is performed on each half of the pluralityof memory cells arranged in the row direction.

During a read operation, a program verify operation, and a programoperation, one of the two bit lines (BLie, BLio) connected to the datastorage circuit 10 is selected in accordance with an externally suppliedaddress signal (YA0, YA1, . . . , YAi, . . . , YAn). Moreover, inaccordance with the external address, one word line is selected, and twopages shown by dashed lines are selected. The two pages are switchedbased on addresses.

Storing two bits in one cell involves two pages. However, storing onebit in one cell involves one page. Storing three bits in one cellinvolves three pages. Storing four bits in one cell involves four pages.

FIG. 3 shows another example of a configuration of the memory cell array1 and the bit line control circuit 2 shown in FIG. 1. In theconfiguration shown in FIG. 2, two bit lines (BLie, BLio) are connectedto the data storage circuit 10. In contrast, in a configuration shown inFIG. 3, the data storage circuit 10 is connected to each bit line, and aplurality of memory cells arranged in the row direction is all connectedto the corresponding bit lines. Thus, a write operation or a readoperation can be performed on all the memory cells arranged in the rowdirection.

The following description is applicable to both the configuration shownin FIG. 2 and the configuration shown in FIG. 3, but the use of theconfiguration in FIG. 3 will be described.

FIG. 4A and FIG. 4B are cross-sectional views of the memory cell and theselect transistor. FIG. 4A shows the memory cell. An n-type diffusionlayer 142 serving as the source and the drain of the memory cell isformed in a substrate 151 (a P-type well region 155 described below). Acharge accumulation layer 144 is formed on the P-type well region 155via a gate insulating film 143. A control gate (CG) 146 is formed on thecharge accumulation layer 144 via an insulating film 145. FIG. 4B showsthe select gate. An n-type diffusion layer 147 serving as the source andthe drain is formed in the P-type well region 155. A control gate 149 isformed on the P-type well region 155 via a gate insulating film 148.

FIG. 5 shows a cross-sectional view of the NAND flash memory. Forexample, the P-type semiconductor substrate 151 comprises N-type wellregions 152, 153, and 154 and a P-type well region 156 formed therein.The P-type well region 155 is formed in the N-type well region 152, anda low-voltage N-channel transistor LVNTr included in the memory cellarray 1 is formed in the P-type well region 155. Moreover, a low-voltageP-channel transistor LVPTr and a low-voltage N-channel transistor LVNTrforming the data storage circuit 10 are formed in the N-type well region153 and the P-type well region 156, respectively. A high-voltageN-channel transistor HVNTr connecting the bit line and the data storagecircuit 10 together is formed in the substrate 151. Furthermore, ahigh-voltage P-channel transistor HVPTr included in, for example, theword line control circuit is formed in the N-type well region 154. Asshown in FIG. 5, the high-voltage transistors HVNTr and HVPTr have, forexample, thicker gate insulating films than the low-voltage transistorsLVNTr and LVPTr.

FIG. 6 shows an example of voltages supplied to regions shown in FIG. 5.For an erase, program, and read, such voltages as shown in FIG. 6 aresupplied to the regions. A voltage applied to the substrate during anerase is denoted by Vera, ground voltage is denoted by Vss, and a powersupply voltage is denoted by Vdd. A voltage applied to the gate of anN-channel MOS transistor in a row decoder during a write is denoted byVpgmh, and is a potential that allows a write voltage Vpgm for the wordline to pass through the N-channel MOS transistor without reducing thewrite voltage Vpgm by an amount equivalent to a threshold voltage forthe N-channel MOS transistor. That is, Vpgmh is equal to the voltagesupplied to the word line Vpgm+Vth (where Vth is the threshold voltageof the N-channel MOS transistor). A voltage applied to the gate of anN-channel MOS transistor in the row decoder during a read is denoted byVreadh, and is a potential that allows Vread to pass through theN-channel MOS transistor without reducing Vread by an amount equivalentto a threshold voltage for the N-channel MOS transistor. That is, Vreadhis supplied to the word line and is equal to Vread+Vth (where Vth is thethreshold voltage of the N-channel MOS transistor).

In addition, a voltage supplied to a word line for an unselected cellduring a write is denoted by Vpass, and a voltage applied to anunselected word line during a read is denoted by Vread.

FIG. 7 and FIG. 8 show an example of the data storage circuit 10 shownin FIG. 3. The data storage circuit 10 comprises a sense amplifier unit(SAU) 10 a and a data control unit (DCU) 10 b shown in FIG. 8.

As shown in FIG. 7, the sense amplifier 10 a comprises a plurality ofN-channel MOS transistors (hereinafter referred to as NMOSs) 21 to 27, aplurality of P-channel MOS transistors (hereinafter referred to asPMOSs) 28 and 29, transfer gates 30 and 31, a latch circuit 32, and acapacitor 33. The latch circuit 32 comprises, for example, clockedinverter circuits 32 a and 32 b.

One end of a current path in NMOS 21 is connected to a node to which thepower supply Vdd is supplied. The other end of the current path isgrounded via transfer gate 30, NMOS 24, and transfer gate 31. Aconnection node between NMOS 24 and transfer gate 31 connects to one endof a current path in NMOS 25. The other end of NMOS 25 is connected tothe corresponding bit line BL in the memory cell array. NMOS 21 connectsin parallel with a series circuit of NMOSs 22 and 23.

Furthermore, one end of a current path in PMOS 28 is connected to a nodeto which the power supply Vdd is supplied. The other end of the currentpath is connected via PMOS 29 to an input end of inverter circuit 32 aincluded in the latch circuit 32 and is grounded via NMOS 26. An inputend of clocked inverter circuit 32 b cross-connected to inverter circuit32 a is connected to the data control unit (DCU) 10 b via NMOS 27.Furthermore, the gate of PMOS 29 is connected to a connection nodebetween NMOSs 22 and 23. The connection node connects to one end of thecapacitor 33. The other end of the capacitor 33 is supplied with a clocksignal CLK.

The gate of NMOS 21 is supplied with a signal BLX. The gate of the NMOSincluded in transfer gate 30 is supplied with a signal LAT at an outputend of inverter circuit 32 a included in the latch circuit 32. The gateof the PMOS transistor is supplied with a signal INV at an input end ofinverter circuit 32 a. The gate of NMOS 24 is supplied with a signalBLC, and the gate of NMOS 25 is supplied with a signal BLS.

The gate of NMOS 22 is supplied with a signal HLL, and the gate of NMOS23 is supplied with a signal XXL.

The gate of PMOS 28 is supplied with a signal STB, and the gate of NMOS26 is supplied with a reset signal RST. The gate of NMOS 27 is suppliedwith a signal NCO.

The operation of the sense amplifier unit will be described in brief.

(Write Operation)

When data is written to a memory cell, first, signal STB is made high,and the reset signal RST is momentarily made high to reset the latchcircuit 32. LAT is made high, and signal INV is made low.

Subsequently, signal NCO is made high to retrieve data from the datacontrol unit 10 b. If the data is low (binary 0), which is indicative ofa write, signal LAT is made low and signal INV is made high.Furthermore, if the data is high (binary 1), which is indicative of anon-write, the data in the latch circuit 32 is unchanged, signal LAT iskept high, and signal INV is kept low.

Then, when signals BLX, BLC, and BLS are made high, if signal LAT at thelatch circuit 32 is low and signal INV at the latch circuit is high(write), transfer gate 30 is off, and transfer gate 31 is on to set thebit line BL to Vss. In this state, when the word line is set to theprogram voltage Vpgm, data is written to the memory cell.

On the other hand, in the latch circuit 32, if signal LAT is high andsignal INV is low (non-write), transfer gate 30 is on and transfer gate31 is off, and thus, the bit line BL is charged to Vdd. Thus, if theword line changes to Vpgm, a channel of the cell is boosted to a higherpotential, preventing data from being written to the memory cell.

(Read Operation and Program Verify Read Operation)

When a memory cell is read, first, the set signal RST is momentarilymade high to reset the latch circuit 32, signal LAT is made high, andsignal INV is made low. Subsequently, signals BLS, BLC, BLX, HLL, andXXL are set to predetermined voltages to charge the bit line BL. Inaddition, the node of the capacitor 33 is charged to Vdd. If a thresholdvoltage for the memory cell is higher than the read level, the memorycell is off, and the bit line is kept high. That is, the node is kepthigh. Furthermore, if the threshold voltage for the memory cell is lowerthan the read level, the memory cell is on, and the bit line isdischarged. Consequently, the bit line BL is made low. Thus, the node ismade low.

Then, when signal STB is made low, if the memory cell is on, the node islow, and thus, PMOS 29 is on to make signal INV at the latch circuit 32high, while making signal LAT at the latch circuit 32 low. On the otherhand, if the memory cell is off, signal INV at the latch circuit 32 iskept low, and signal LAT at the latch circuit 32 is kept high.

Subsequently, when signal NCO is made high, NMOS 27 is on to transferthe data in the latch circuit 32 to the data control unit 10 b.

A program verify operation of verifying the threshold voltage of thememory cell after the write operation is approximately similar to theabove-described read operation.

FIG. 8 shows an example of the data control unit (DCU) 10 b.

The data control unit 10 b shown in FIG. 8 comprises an arithmeticcircuit 40 and a plurality of data latch circuits ADL, BDL, XDL, andNMOS 41.

The arithmetic circuit 40 comprises a bus (hereinafter referred to asthe IBUS), transfer gates 42 and 43 connected to respective oppositeends of the IBUS and operating complementarily, a latch circuit 44configured to latch data from the IBUS, and a setting circuit 45configured to set levels for data latch circuits ADL, BDL, and XDL.

Transfer gate 42 operates in accordance with complementary signals CONDand CONS to connect a bus for the sense amplifier unit SAU 10 a(hereinafter referred to as the SBUS) and the IBUS together.

Transfer gate 43 operates in accordance with complementary signals CONSand COND to connect the IBUS to a bus to which data latch circuits ADL,BDL, and XDL are connected (hereinafter referred to as the DBUS). Whiletransfer gate 42 is on, transfer gate 43 is off. While transfer gate 42is off, transfer gate 43 is on.

The latch circuit 44 comprises a plurality of PMOSs 46 to 49, aplurality of NMOSs 50 to 56, and an inerter circuit 68. The gate of PMOS46 and the gate of NMOS 50 are supplied with a set signal SET. The gateof PMOS 48 is supplied with a reset signal REST. The gate of NMOS 53 issupplied with a signal IFH. The gate of NMOS 55 is supplied with asignal IFL. The gate of NMOS 54 is connected to the IBUS via theinverter circuit 68. The gate of NMOS 56 is connected to the IBUS.

The setting circuit 45 comprises PMOSs 57 to 60 and NMOSs 61 to 64. Thegate of PMOS 57 and the gate of NMOS 61 are supplied with a signal FAIL.Signal FAIL is a signal at a connection node between PMOS 47 and NMOS 51serving as one output end of the latch circuit 44. The gate of PMOS 59and the gate of NMOS 63 are supplied with a signal MTCH. Signal MTCH isa signal at a connection node between PMOS 49 and NMOS 52 serving as theother output end of the latch circuit 44. Moreover, the gate of PMOS 58is supplied with a signal M2HB, and the gate of PMOS 60 is supplied witha signal F2HB. The gate of NMOS 62 is supplied with a signal F2L, andthe gate of NMOS 64 is supplied with a signal M2L.

Data latch circuits ADL, BDL, and XDL have the same configuration andeach comprise a latch circuit 66 and a transfer gate 65 configured toconnect the latch circuit 66 to the DBUS. Each transfer gate 65 iscontrolled by signals BLCA, BLCB, BLCX, BLCA_B, BLCB_B, and BLCX_B. Datalatch circuit XDL is connected to an external I/O via NMOS 41. The gateof NMOS 41 is supplied with a signal CSL.

The data control unit 10 b holds write data, and during a read, holdsread data.

Two-bit write data supplied by a data I/O buffer 6 is latched by, forexample, data latch circuits ADL and BDL via data latch circuit XDL sothat each of data latch circuits ADL and BDL latches one of the twobits.

The arithmetic circuit 40 shown in FIG. 8 can perform arithmeticoperations such as an AND operation, an OR operation, and an exclusiveNOR operation on data in data latch circuits ADL and BDL. For an ANDoperation, the data held in data latch circuits ADL and BDL are outputto the DBUS and the IBUS. In this case, the IBUS is made high only ifboth the data held in data latch circuits ADL and BDL are 1, and isotherwise made low. That is, the IBUS is at 1 only during a non-writeand is at 0 during a write. A write is performed by transferring thedata held in data latch circuits ADL and BDL to the sense amplifier unit10 a shown in FIG. 7.

The arithmetic circuit 40 shown in FIG. 8 may be provided such that onearithmetic circuit 40 is disposed for a plurality of the sense amplifierunits (SAU) 10 a shown in FIG. 7 and a plurality of data control units(DCU) 10 b shown in FIG. 8. This enables a reduction in circuit area.

The operation of the arithmetic circuit 40 may be varied. For example,various control methods are applicable to one logical operation, and thecontrol method may be changed as necessary.

The NAND flash memory according to the present embodiment is amultilevel memory and can thus store two-bit data in one cell. The twobits are switched based on the addresses (first page and second page).Storing two bits in one cell involves two pages, but if three bits arestored in one cell, each bit is switched based on the addresses (firstpage, second page, and third page). Moreover, if four bits are stored inone cell, each bit is switched based on the addresses (first page,second page, third page, and fourth page).

According to the present embodiment, one-bit data can be stored in onecell, but if two-bit data is stored in one memory cell, the two-bit datais switched based on the addresses (first page and second page).Furthermore, if three-bit data is stored in one memory cell, thethree-bit data is switched based on the addresses (first page, secondpage, and third page). Moreover, if four-bit data is stored in onememory cell, the four-bit data is switched based on the addresses (firstpage, second page, third page, and fourth page).

In the case described below, for example, data is written and read, at atime, to and from the memory cells arranged in the row direction asshown in FIG. 3, and two-bit, four-level data is stored in one cell.

(Threshold Voltage Distribution)

FIG. 9A and FIG. 9B show the state of data in a memory cell, thethreshold voltage, a verify level, and the read level after two-bit,four-level data is written to the first page and the second page.

As shown in FIG. 9A, an erase operation sets the threshold voltage forthe data in the memory cell to 11. When data is written to the firstpage, the memory cell remains in an erased state or the write isperformed at level LMV and the threshold voltage for the data in thememory cell is set to 11 or 10.

As shown in FIG. 9B, when data is written to the second page, the memorycell remains in the erased state or the write is performed at one oflevels AV, BV, and CV and the threshold voltage for the data in thememory cell is set to 11, 01, 00, or 10. The verify level is setslightly higher for a write than for a read in order to provide a dataretention margin. In FIG. 9A and FIG. 9B, the read level is denoted byLMR, AR, BR, and CR, and the verify read level is denoted by LMV, AV,BV, and CV.

(Program Operation)

A write is sequentially performed starting with memory cells closest tothe source line. That is, a write is sequentially performed startingwith the memory cells connected to word line WL0 and ending with thememory cell connected to word line WL63, as shown in FIG. 3.

First, the data for the first page to be written to word line WL0 istemporarily stored in data latch circuit XDL in the data storage circuit10 shown in FIG. 8.

Subsequently, the data stored in data latch circuit XDL is written tothe first page of each of the memory cells on word line WL0.

Then, the data for the first page to be written to word line WL1 istemporarily stored in data latch circuit XDL in the data storage circuit10 shown in FIG. 8.

Subsequently, the data stored in data latch circuit XDL is written tothe first page of the memory cells on word line WL1.

Moreover, the data for the second page to be written to word line WL0 istemporarily stored in data latch circuit XDL in the data storage circuit10 shown in FIG. 8.

Subsequently, the data stored in data latch circuit XDL is written tothe second page of the memory cells on word line WL0.

When the data for the first and second pages is thus written, such athreshold voltage distribution as shown in FIG. 9A and FIG. 9B isobtained.

Subsequently, a write is performed on the first page on word line WL2and then on the second page on word line WL1.

(Read Operation)

On the other hand, when data is read from a memory cell to which datahas been written as described above, soft bit read is performed.According to the present embodiment, the soft bit read involves readingdata with a sense timing different from the sense timing for the normalread.

FIG. 10 shows signal waveforms at the sections of the memory cell array1 and the data storage circuit 10 during a read.

During a read, the corresponding bit line is supplied with apredetermined voltage (for example, 0.6 V+Vfix; a fixed voltage isdenoted by Vfix), and a selected word line is supplied with read levelvoltages AR, BR, and CR shown in FIG. 9B. If the threshold voltage ofthe memory cell is lower than the voltage of the word line, the memorycell is on and the voltage of the bit line is made low. If the thresholdvoltage of the memory cell is higher than the voltage of the word line,the memory cell is off and the voltage of the bit line is made high.

Now, the node in the sense amplifier unit 10 a shown in FIG. 7 isprecharged to make CLK high, while setting signal XXL to, for example,0.45 V+Vth+Vfix. Then, when the potential of the bit line is low, thenode in the sense amplifier unit 10 a is made low. When the potential ofthe bit line is high, the node in the sense amplifier unit 10 a is madehigh. Subsequently, the clock signal CLK is made low, and the voltage ofthe bit line is read.

(Normal Read Operation)

FIG. 11 shows relationships between the normal read operation and readdata. In a read from the second page, the potential of the word line isset to BR. If the threshold of a memory cell is lower than BR, datalatch circuit XDL is made low to output binary 1. On the other hand, ifthe threshold of the memory cell is higher than BR, data latch circuitXDL is made high to output binary 0.

Then, during the first read from the first page, first, the potential ofthe word line is set to AR. If the threshold voltage of the memory cellis lower than AR, the node in the sense amplifier unit 10 a is made low.On the other hand, if the threshold voltage of the memory cell is higherthan AR, the node in the sense amplifier unit 10 a is made high. Theresult is held in one of data latch circuits ADL, BDL, and XDL, forexample, ADL.

Subsequently, during the second read from the first page, the potentialof the word line is set to CR. If the threshold voltage of the memorycell is lower than CR, the node in the sense amplifier unit 10 a is madelow. On the other hand, if the threshold voltage of the memory cell ishigher than CR, the node in the sense amplifier unit 10 a is made high.The result is held in data latch circuit BDL.

The arithmetic circuit 40 performs a logical operation, for example, anXNOR operation on the result of the second read held in data latchcircuit BDL and the result of the first read held in data latch circuitADL. As a result of the operation, if the threshold voltage of thememory cell is lower than AR or higher than CR, output is binary 1. Ifthe threshold voltage of the memory cell is higher than AR and lowerthan CR, output is binary 0.

(Read Operation During Soft Bit Read)

ECC such as LDPC requires data referred to as a soft value and which isdifferent from data read at the normal read level. FIG. 12 showsrelationships between read data and the read level during a soft bitread.

For the soft bit read, the threshold voltages of memory cells are readat read levels AR-d, BR-d, and CR-d set slightly lower than read levelsAR, BR, and CR and read levels AR+d, BR+d, and CR+d set slightly higherthan read levels AR, BR, and CR, and the results are subjected to anXNOR operation and then externally output.

Moreover, an XNOR operation may be performed on the results of a softbit read from the first page and the second page, and the resultantone-bit data may be externally output.

As shown in FIG. 12, the range within which soft bit read data is 0 isnot the main part of the threshold voltage distribution. Thus, the datawithin this range is expected to be unlikely to be incorrect, and ECC iscarried out. In the conventional technique, data is read from memorycells by three read operations at AR, BR, and CR, respectively. However,at each of the read levels, a read operation must be performed at a readlevel set slightly lower than the original read level and at a readlevel set slightly higher than the original read level. Thus, theconventional technique involves 3×3=9 read operations, requiring muchtime for the read operations.

First Embodiment

FIG. 13 shows relationships between a current flowing through a memorycell and the threshold voltage of the memory cell. When the thresholdvoltage of a memory cell is, for example, equal to read level BR-d, aread with the potential of the word line set to BR results in a highercurrent flowing through the memory cell. Thus, as shown in FIG. 14, thebit line is discharged quickly, and thus, a sense operation is performedwith the time for the discharge of the bit line reduced.

On the other hand, for a memory cell with the threshold voltage thereofequal to read level BR+d, a read with the potential of the word line setto BR reduces the current in the memory cell. Thus, as shown in FIG. 14,the bit line is discharged slowly, and thus, a sense operation isperformed with the time for the discharge of the bit line increased.

Specifically, during a read, after the discharge of the bit line isstarted, signal HLL and the clock signal CLK are supplied three times;signal HLL is supplied to the gate electrode of the transistor 22included in the sense amplifier unit 10 a shown in FIG. 7 and the clocksignal CLK is supplied to the capacitor 33. In accordance with thisoperation, the potential of the node is held in the latch circuit 32.That is, if the threshold voltage of the memory cell is much lower thanthe voltage of the word line, the discharge time for the bit line isshort. Thus, when the first clock signal is supplied, the potential ofthe node is low. Furthermore, if the threshold voltage of the memorycell is slightly lower than the voltage of the word line, the dischargetime for the bit line is slightly short. Thus, when the first clocksignal is supplied, the potential of the node fails to be made low.Then, when the second clock signal is supplied, the potential of thenode is made low. Moreover, if the threshold voltage of the memory cellis slightly lower than the voltage of the word line, the discharge timefor the bit line is slightly short. Thus, when the second clock signalis supplied, the potential of the node fails to be made low. Then, whenthe third clock signal is supplied, the potential of the node is madelow. Furthermore, if the threshold voltage of the memory cell is higherthan the voltage of the word line, the bit line is kept high. Thus, evenwhen the third clock signal is supplied, the potential of the node ishigh. The potential of the node is held in the latch circuit 32.

Such a sense operation eliminates the need for three read operationswith the level of the word line varied between one read level, aslightly higher read level, and a slightly lower read level. That is, aread operation with the level of the word line unchanged and with thesense timing for the bit line changed exerts reading effects similar tothose of a read operation at a plurality of levels.

FIG. 15 shows data read by a soft bit read with the sense timingchanged. In a read operation performed on one word line, a soft bit readcan be achieved by changing the discharge time for the bit line and thetiming for the sense operation.

First, a second page read operation is performed. In the second pageread operation, data is read three times with the voltage of theselected word line fixed to, for example, BR and with the sense time forthe bit line changed. That is, as shown in FIG. 15, the first sense, thesecond sense, and the third sense for the second page read allow threedata to be read. The data resulting from the second sense at BR is thesecond page read data and may thus be externally output without change.A logical operation, for example, an XNOR operation is performed, by thearithmetic circuit 40, on data resulting from the first sense at BR anddata resulting from the third sense at BR. These data are, for example,held in any of latches ADL, BDL, and XDL.

Then, the first read operation on the first page is performed. In thefirst read operation on the first page, data is read three times withthe voltage of the selected word line fixed to, for example, AR and withthe sense time for the bit line changed. That is, as shown in FIG. 15,the first sense, the second sense, and the third sense for the firstread from the first page allow three data to be read. The data resultingfrom the second sense at AR is the first page AR read data. A logicaloperation, for example, an XNOR operation is performed, by thearithmetic circuit 40, on data resulting from the first sense at AR anddata resulting from the third sense at AR. Moreover, an XNOR operationmay further be performed on the result of the XNOR operation at AR andthe above-described result of the XNOR operation at BR. These data are,for example, held in any of latches ADL, BDL, and XDL.

Finally, the second read operation on the first page is performed. Inthe second read operation on the first page, data is read three timeswith the voltage of the selected word line fixed to, for example, CR andwith the sense time for the bit line changed. That is, as shown in FIG.15, the first sense, the second sense, and the third sense for thesecond read from the first page read allow three data to be read. Alogical operation, for example, an XNOR operation is performed, by thearithmetic circuit 40, on data resulting from the second sense at CR anddata resulting from the second sense at AR. These data are read from thefirst page and are thus externally output.

A logical operation, for example, an XNOR operation is performed, by thearithmetic circuit 40, on data resulting from the first sense at CR anddata resulting from the third sense at CR. Moreover, an XNOR operationmay further be performed on the result of the XNOR operation at CR andthe above-described results of the XNOR operations at AR and BR. Thesedata are, for example, held in any of latches ADL, BDL, and XDL. Thedata are subsequently externally output.

An XNOR operation may be performed on the read data to obtain the sameread data and soft bit data as the read data and soft bit data in FIG.13.

The above-described first embodiment enables a soft bit read by, duringa read, applying the voltage at the predetermined level to the selectedword line and changing the sense timing for the sense amplifier. Thefirst embodiment thus enables a reduction in read time compared to acase where a soft bit read is carried out with the voltage of the wordline changed.

The first embodiment uses one word line to carry out a soft bit readwith one read data at two levels. However, soft bit data may be read by,for example, using the normal read operation and changing the sensetiming only for the soft bit read.

Furthermore, reads at levels AR, BR, and CR and a soft bit read at therespective levels may be carried out at the level of one word line orseveral word lines.

A parameter is set for each sense timing and stored in a chip.

When both the normal read and the soft bit read are carried out, aslight deviation may occur between the normal read and the soft bit readbut soft values including the deviation are subjected to ECC.

Second Embodiment

To allow the optimum read level to be determined, a method has beenproposed which involves changing the read level of the word line littleby little, searching for an end of the threshold voltage distribution,determining the optimum read level, and then performing a readoperation. However, this method disadvantageously takes a long timebecause the read level is changed little by little.

Thus, as shown in FIG. 17, the second embodiment uses, as a word linepotential, one level or several levels based on the number of thresholdvoltage distributions, and like the first embodiment, changing, during aread operation at each word line potential, the sense timing of thesense amplifier with respect to the discharge time for the bit line tosearch for the end of the threshold voltage distribution. That is, thepotential of the bit line is detected with the sense timing changed, andas shown in FIG. 17, the end of the threshold voltage distribution issearched for based on the timing when the current starts increasing. Theoptimum read voltage is determined to be the searched-for thresholdvoltage +α, that is, the threshold voltage plus an offset.

The second embodiment allows the optimum read level to be determined foreach threshold voltage distribution. The second embodiment furthereliminates having to perform a plurality of read operations with theword line level changed by setting a potential higher or lower than thepotential of each word line. This enables the optimum read level to besearched for at high speed.

The read operation at a plurality of levels is effective for enablingthe optimum read level to be determined to be the smallest value of theaggregated numbers of bit memory cells or the smallest value plus anoffset.

(Modification)

The second embodiment changes the sense timing a plurality of times asshown in FIG. 14. An interval of time must be provided between the sensetimings to achieve stability. This may hinder short timing intervalsfrom being set.

The present embodiment searches for the end of the threshold voltagedistribution. For example, when the page is 16 KB in size, the presentembodiment enables the end of the distribution to be searched for basedon, for example, 1-KB distribution data without having to search thedistribution of all of 16-KB data. Thus, the end of the thresholdvoltage distribution may be searched for by dividing a plurality of bitlines shown in FIG. 2 or FIG. 3 into a plurality of groups and varyingthe sense timing among the groups.

FIG. 19 is a timing chart showing a modification of the secondembodiment. As shown in FIG. 19, the bit lines are divided into aplurality of groups, group 1, group 2, group 3, . . . , and the sensetiming is varied among the groups. Then, the end of the distribution canbe searched for based on, for example, 1-KB distribution data.

Furthermore, a cell close to a word line drive circuit involves ashorter time until the sense timing is stabilized, than a cell remotefrom the word line drive circuit because the corresponding word linerises earlier. Thus, NAND units may be divided into a plurality ofgroups depending on the distance from the word line drive circuit to thecorresponding bit line, and the end of the threshold voltagedistribution may be searched for each group. Of course, also in thiscase, the sense timing may be varied among the groups or the rise timeof the word line may be set later than usual in order to change thesense timing.

Furthermore, the second embodiment changes the read level of the wordline little by little in order to determine the optimum read level andchanges the sense timing a plurality of times to search for the end ofthe threshold voltage distribution. At this time, data read at each readlevel of the word line or sense timing may be output to, for example, acontroller located externally to the NAND flash memory so that thecontroller can process the data. However, the time required toexternally output the data may pose a problem.

In this case, as shown in FIG. 20, a cache function may be utilized suchthat while the results of a read at the first word line level or sensetiming are being externally output, a read is performed at the next,second word line level or sense timing.

Alternatively, externally outputting the read results may be avoided,and a counter may be provided inside the NAND flash memory to count theread results inside the chip and to output only the count resultexternally to the chip.

Alternatively, externally outputting the count result may be avoided,and the count result may be held inside the chip so that the optimumread level can be automatically set based on the read results for aplurality of word line levels or sense timings.

Furthermore, if the counter inside the NAND flash memory is used forcounting, the counting is carried out for every bit to every severalbits and may thus take a long time.

In this case, as shown in FIG. 21, a cache function may be utilized suchthat while the read results are being counted at the first word linelevel or sense timing, a read can be performed at the next, second wordline level or sense timing.

Third Embodiment

FIG. 18 shows a memory cell and relationships between data read by thefirst page read and data read by second page read and data read by asoft bit read. Three-bit data is output based on the threshold levels ato j of the memory cell. However, the main distribution of the memorycell to which data has been written is present in a, d, g, and j.Consequently, a read operation often allows these data to be output.Thus, the data corresponding to a, d, g, and j is expressed mainly astwo bits, and the other data is expressed as three bits or four bits.

The third embodiment expresses the data corresponding to the maindistribution a, d, g, and j as two bits and expresses the other data asthree bits or four bits, enabling a reduction in total output data.

The first and second embodiments change the sense timing to obtain datacorresponding to reads at a plurality of word line levels as shown inFIG. 13 and FIG. 17, respectively. However, for the NAND flash memory,it is known that the cell current (Icell) decreases with increasingnumber of erase and write times.

The reduced cell current can be increased by raising the level of thebit line during a read. Thus, when the reduced cell current is to beavoided, a region is provided in which the number of erase loops isstored for each block that is an erase unit. When erase is carried out,the number of erases is stored in this region. Subsequently, during aread or program operation, the cell current can be increased by readingthe number of erases stored in this region, and changing the level ofthe bit line for a read and program verify read depending on the readnumber of erases.

Of course, the level of the bit line for a read based on the number oferases can be used for a normal read and program verify read, which aredifferent from the ?soft bit read according to the first embodiment andthe search for the end of the threshold voltage distribution accordingto the second embodiment.

While certain embodiments have been described, these embodiments havebeen presented by way of example only, and are not intended to limit thescope of the inventions. Indeed, the novel embodiments described hereinmay be embodied in a variety of other forms; furthermore, variousomissions, substitutions and changes in the form of the embodimentsdescribed herein may be made without departing from the spirit of theinventions. The accompanying claims and their equivalents are intendedto cover such forms or modifications as would fall within the scope andspirit of the inventions.

What is claimed is:
 1. A semiconductor memory device comprising: amemory cell array comprising memory cells arranged in a matrix, each ofthe memory cells connected to each of word lines and each of bit lines;a sense amplifier connected to the bit lines and configured to detect avoltage of the bit lines; and a control circuit configured to controlpotentials of the word lines and the bit lines, wherein the bit linesare divided into a first group and a second group, h memory cells (whereh is a natural number) of the memory cells being simultaneously readfrom the memory cell array, and in a read of k levels (where k is anatural number) stored in the memory cells, a sense timing of the firstgroup differs from a sense timing of the second group when a givenvoltage is applied to the word lines.
 2. The device of claim 1, whereinbased on results read from each of the first and second group, optimumread levels are determined for each threshold voltage distribution.
 3. Asemiconductor memory device comprising: a memory cell array comprisingmemory cells arranged in a matrix, each of the memory cells connected toeach of word lines and each of bit lines; a sense amplifier connected tothe bit lines to detect a voltage of the bit lines; and a controlcircuit configured to control potentials of the word lines and the bitlines, wherein the bit lines are divided into a first group and a secondgroup, h memory cells (where h is a natural number) of the memory cellsbeing simultaneously read from the memory cell array, and in a read of klevels (where k is a natural number) stored in the memory cells, a risetime of the word lines of the first group differs from a rise time ofthe word lines of the second group when a given voltage is applied tothe word lines.
 4. The device of claim 3, wherein based on results readfrom each of the first and second group, optimum read levels aredetermined for each threshold voltage distribution.